SYSKEY - LAB-PVD High Vacuum Sputtering System

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SYSKEY Technology LAB-PVD High Vacuum Sputtering System

Syskey LAB-PVD Sputtering System is specifically designed for R&D and long-term reliability performance in Co-sputter metal deposition process up to six inches wafer.

SPECIFICATIONS 
Main unit dimension
■ 1450(W) x 1120(D) x 1900(H)mm
High Vacuum Reactor 
■ SUS304, 450(W) x 500(H) x 450(D)mm
■ 4" diameter view port
■ Chamber door opening/closing by manual operation. 
■ Easily removable coating protection shields. 
Sputter Cathodes 
■ ANGSTROM 3" diameter magnetron enhanced sputter cathodes * 2 sets plane.
■ Co-sputtering up deposition configuration.
■ Each for DC/RF capability.
■ Each cathode with substrate distance & angle variable.

■ Cooling water flow sense safety interlock.

■ Each with pneumatic shutter drive.

Substrate holder 

■ Max. 6" * 1 piece substrate holder. 
■ Substrate holder rotary drive (5-20 RPM speed range). 
DC power supply 
■ AE MDX500 Magnetron Drive DC Power supply (500W output) with remote setup/readout triplex control on voltage, current, power.
RF power supply 
■ Cesar136(13.56MHz*600W) RF Generator & Matching box.
Gas Lines & valve
■ AE Aera F7700CD Mass Flow Controllers for Ar 200sccm. 
■ Swagelok, bellows seal stop valves (air operated)
■ 1/4" SUS316L EP tubing with VCR or Swagelok fitting. 
Vacuum control system
■ Inficon PKR251 Cold cathode + Pirani full range vacuum gauge.

■ Inficon TPR-280 Pirani gauge. 
Vacuum Pump 
■ Alcatel 2033series(500 liters/min) Two-stages rotary pump. 
■ Adixen ATH400M(400 liters/sec) Turbomolecular or same grade pump with controller. 
Pressure control 
■ HVA 11211-0603R pneumatic actuator high vacuum gate valve. 
Valves 
■ Rough vacuum valve: NW40 pneumatic valve. 
■ Fore-line valve: NW25 pneumatic valve. 
■ Vent valve: 1/4” pneumatic valve. 
System Control 
■ PC-Based Computer interface for automatic operation with full manual operation.
■ Graphic multi-tasking real time control/display software operating for all sensors and drives under Microsoft WINDOWS. 
■ Automatic process sequences delivered: 1) Autopump, 2) Autovent, 3) Multi-steps coating
procedures.
■ Multiple operation modes: 1) Manual, 2) Automatic, 3) Maintenance and 4) Automatic process
sequence generation and editing.
■ Alarm history and process parameters history backup abilities. 
Facility Requirements 
(The following utility requirements are listed as a reference only, the final utility
requirements will be confirmed before the system shipment.)
Power
■ AC 220 V, 3P, 60Hz, 50A.
Ground
■ Electrical resistance < 5Ω, Copper board > 5mm × 50mm
Dry Air
■ 4~6 kg/cm2 supply pressure.
■ 6mm quick fitting × 1.
Evacuation Duct
■ NW25 fitting, for rotary pump exhaust
Cooling Water
■ 1~2 kg/cm2 supply pressure, 15 liters/min @20oC.
■ 1/2" hose connect fittings x 2.
■ Differential pressure > 1.5 kg/cm2.

More information available upon request.