The Rapid thermal process of RTP-Table Type is served 4"~6 "( 3", 2 " wafer available) manual load/unload operation.
The chamber design with a Halogen lamp as the heating source.
The operator put the wafer to be processed into the chamber manually for process needs. The rapid heating and cooling processes can be accurate to complete based on the pre-setting recipe.
The machine controller under PC-based and Windows system as the main operate interface.
Tool Characteristics
-Double and side Tungsten wire halogen lamp heating.
-10Heating-zones lamp temperature control system to provide good temperature uniformity.
-Rapid closed loop temperature control.
-Each lamp has a heating current detection function to monitor the process status.
-Third-level user rights to differentiate between operational,maintenance, and management functions.
-Process stability automatically detects the warning function.
-Window based control interface with machine information and control in one.
-Each process information system will be automatically archived with the Lot-ID and time.
System Specifications :
1. Machine size : 810Wx790Lx600H (mm)
2. Machine weight : 100kg
3. Chip transfer model : Manual Load / Unload
4. Wafer size : 6”,4”,3” and 2inch
5. Temperature range : 800~1200℃ (Max hold 30sec) *Below 800℃ needs Option R-Type TC
6. Heating rate : 50℃/sec for Graphite
7. Temperature uniformity : [1] 800℃ hold 30 Sec , [2] 1200℃ hold 30 Sec, ≧800℃±1%
8. Temperature reproducibility : ±2℃
9. Process gas : Standard 2 groups
10. Heating source : 29pieces 3KW of Halogen Lamp
11. In-line Temperature monitoring : R type Thermal Couple (800~1300℃) / Pyrometer (800~1300℃)
12. Vacuum : Not Available