ASM - WS896

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Specifications:

Scanning speed : 10 min for 4" expanded wafer (12 mil die size)

Detectable defect size : min 0.3 mil (7.6um)

Material Handling Capability :

Die size : 4-160 mil

Wafer size : up to 5.5" (expanded)

Wafer ring : foton ring type

Dimensions & Weight :

L1090xW860xH1940 (mm) / Net Weight : 700kg

More information available on request.