MATTECH - WB-H15000 Wafer Bonding Machine

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Specifications: 

Machine power consumption: 220V-3p-60Hz 6Kw 

Machine size specification: (W * H * D): 800 * 2000 * 1000 (mm) 

The maximum operating temperature and temperature control tolerance specification: 

    a) The maximum operating temperature. = 600 ℃ heating rate ≦ 150 ℃ / MIN 

    b) the temperature difference between the upper and lower pressure head (between 200 ℃ --600 ℃ temperature range) △ T ≦ ± 5 ℃ 

    c) 3 "wafers inside and outside temperature tolerance △ T ≦ ± 5 ℃ 

    d) wafer cooling rate: 600 ℃ down to 100 ℃, less than 30 minutes 

    e) Chip Bonding Range 2 "~ 6" wafer 

Pressure Control: 

    a) conduct initial soft pressing 0-300kg linear boost, then swing for the program settings can be controlled. 

    b) up to contribute to 15000kg 

Vacuum level specification: 

    b) 9 * E-3 torr within 4 minitus. 

    b) to sus304 stainless steel vacuum chamber 

 

More information available on request.