Configuration:

 

MA4200 exposure system is an all function in one facility printing patterns on photoresist-coated substrates aligned with a mask. MA4200 provides a fully automatic and high-speedy system on substrate loading, alignment, exposure and unloading to increase production efficiency which is ideal for LED, wafer Mems Industries.

 

High-speed, high-accurate exposure performance

Low operation cost, High productivity

Auto alignment on wafers

High efficient dual arm robot handling system

 

Substrate Size ~ Sapphire, GaN 2"- 4"

Mask Size ~ 5"x5"

Light source ~ Super-high pressure 500W lamp  1

Intensity uniformity ~ 5%