MOCVD (BEOL) Equipment / Bonders / AST Tbon-100 , Wafer Bonder

  • 2000300
  • 2000300
  • 2000300

 Application

The latest Wafer Bonder Tbon-100 from AST is equipped with advanced integrated contact pressure control, vacuum environment and separate heater design capable for independent multistage control vacuum hot embossing.
Applications include Group III-V Power Chip LED, MEMS and SOI production processes exceeding industry-standard in uniformity and yield rate.
 
Features
Tbon-100 Wafer Bonder features include:
(1) High throughput
(2) High process quality reproducibility and stability
(3) Full-automatic control interface
(4) Modular design with minimum footprint
 
Specifications
Wafer Numbers / Sizes : 1 pairs / (2"- 6")
Press Force : 3.5 ~ 10 KN (Option)
Upper/Lower Temperature Control : 350 ~ 700 oC (Option)
Base Pressure : < 1 Torr
Pumping System : Oil-Free Dry pump
Automatic Control System : Industrial HMI with Graphic User Interface
Power Requirement : AC220V, 3 phase, 60 Hz, 30A
Dry N2 Requirement : 1.2 kgw/cm2
CDA Requirement : 5 kgw/cm2
Water Requirement : 1.5 kgw/cm2, 20℃, 10 l/min
Dimension (WxDxH) : 850 x 800 x 1650 (mm)
Weight : 120 kgw